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US Patent Issued to SAMSUNG ELECTRONICS on Nov. 3 for "Semiconductor devices" (South Korean Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,381, issued on Nov. 3, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Semiconductor devices" was invented by Junbeom... Read More


US Patent Issued to SAMSUNG ELECTRONICS on Nov. 3 for "Semiconductor device" (South Korean Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,382, issued on Nov. 3, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Semiconductor device" was invented by Pilkwang... Read More


US Patent Issued to SAMSUNG ELECTRONICS on Nov. 3 for "Semiconductor devices" (South Korean Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,383, issued on Nov. 3, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Semiconductor devices" was invented by Jeewoon... Read More


US Patent Issued to SAMSUNG ELECTRONICS on Nov. 3 for "Integrated circuit device" (South Korean Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,384, issued on Nov. 3, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea). "Integrated circuit device" was invented by Kyu... Read More


US Patent Issued to ROHM Co. on Nov. 3 for "Silicon carbide semiconductor substrate and semiconductor device" (Japanese Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,385, issued on Nov. 3, was assigned to ROHM Co. LTD. (Kyoto, Japan). "Silicon carbide semiconductor substrate and semiconductor device" was ... Read More


US Patent Issued to ENKRIS SEMICONDUCTOR on Nov. 3 for "Method of manufacturing semiconductor structure and semiconductor structure" (Chinese Inventor)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,386, issued on Nov. 3, was assigned to ENKRIS SEMICONDUCTOR INC. (Suzhou, China). "Method of manufacturing semiconductor structure and semic... Read More


US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Nov. 3 for "Semiconductor device with facet S/D feature and methods of forming the same" (Taiwanese Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,387, issued on Nov. 3, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING Co. LTD. (Hsinchu, Taiwan). "Semiconductor device with facet S/D f... Read More


US Patent Issued to QUALCOMM Incorproated on Nov. 3 for "Vertical channel field effect transistor (VCFET) with reduced contact resistance and/or parasitic capacitance, and related fabrication methods" (California Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,388, issued on Nov. 3, was assigned to QUALCOMM Incorproated (San Diego). "Vertical channel field effect transistor (VCFET) with reduced con... Read More


US Patent Issued to Taiwan Semiconductor Manufacturing on Nov. 3 for "Semiconductor devices having counter-doped structures" (Taiwanese Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,389, issued on Nov. 3, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Semiconductor devices having counter-... Read More


US Patent Issued to SAMSUNG ELECTRONICS on Nov. 3 for "Semiconductor substrate, semiconductor device including the same, and method for fabricating the same" (South Korean Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,390, issued on Nov. 3, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Semiconductor substrate, semiconductor device ... Read More